The ground wiring of C1, C2, C3, C4 and IC2
Solder the lead of C4 at 21C. Solder the tip of 0.32 mm tin coated wire( In the following, it is called only wire ).-
( This is called presoldering. )
Presoldering wire is taken to 21C as it goes along to the print board as much as possible from 21D direction and solder to 21C.-
( The first point holds the wire with the hand of an other side. and the wire can be fixed only melting the solder. )
At this time you do not worry about the finish of soldering.
Because this soldering is only done tentatively, presoldering is not necessary. Cut the wire at 21O. Solder at 21H, 21E and 21K to the turn. At this time, desolder at 21C and 21M by useing solder sucker.-
( For cleaning of the tentative solder )
Solder at 21C and 21M again. Solder at 21D, 21F, 21G, 21I, 21J, 21L and 21N to the turn. The ground wiring of IC1 Solder the lead of IC1 at 19K. Presoldering wire is taken to 19K as it goes along to the print board as much as possible from 19L direction and solder to 19K. Cut the wire at 19O, and solder it at 19N. Solder at 19L and 19M to the turn. The ground wiring of TR1 and TR2 Solder the lead of TR1 at 10E. Presoldering wire is taken to 10E as it goes along to the print board as much as possible from 10F direction and solder to 10E. Pull the wire and fix it to 10M by temporary soldering. Solder at 10K first and solder at 10H, 10F, 10G, 10I and 10J to the turn.-
Don't solder of 10F previously, solder of 10E is to have melted with the heat at the time of soldering of 10F.
Bend the wire from 10N to 11O and toawrd 12O direction.-
To solder of long distance, soldering is easy when it holds down with the clip shown with the photograph below.
